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| working procedure | project | Process capability | remarks | |
| classification | routine | special | ||
| product | Number of layers | Floors 1-6 | ||
| Finished product shape | ±0.1mm | ±0.05mm | ||
| Dimensional tolerance | ||||
| Minimum size of finished product | 5*5mm | 3*3mm | ||
| FPC plate thickness | Single panel: 0.08-0.13mm | Minimum: 0.05mm | Receiving orders outside the normal capacity | |
| Double sided plate: 0.10-0.25mm | Minimum: 0.08mm | Need review before | ||
| Three layer plate: 0.20-0.25mm | Minimum: 0.18mm | |||
| Four layer plate: 0.25-0.30mm | Minimum: 0.20mm | |||
| FPC plate thickness tolerance | Single and double-sided plate: ± 0.03mm | |||
| Multilayer board: ± 0.05mm | ||||
| Gold finger area tolerance | ±0.03mm | |||
| engineering | Multilayer laminated structure | Three layer board: 1 double and 1 single | 1 single | |
| Design | Four layer board: 1 single, 1 double and 1 single; | 1 double 1 double / 1 single 1 single 1 single | ||
| Minimum distance between line edge and forming edge | 0.2mm | 0.1mm | To achieve 0.1mm, it needs to be made by laser or fine steel mold | |
| Mosaic size | Length * width: within 250mm * 300mm | Max. 250 * 500mm | Beyond special abilities | |
| Process edge size | Single panel: single side ≥ 7mm | Unilateral ≥ 5mm | Review before receiving orders | |
| Double sided plate: single side ≥ 7mm | Unilateral ≥ 5mm | |||
| Multilayer board: single side ≥ 12mm | Unilateral ≥ 10mm | |||
| drill hole | Borehole diameter | 0.1-6.35mm | Minimum aperture 0.07mm | |
| Slot hole diameter | 0.8mm*1.5mm | 0.5-1.0mm | ||
| Bore tolerance | PTH hole: ± 0.075mm | |||
| Npth hole: ± 0.05mm | ||||
| Hole position accuracy | Primary drilling: ± 0.075mm | |||
| Secondary drilling: ± 0.1mm | ||||
| copper plating | Hole copper thickness | Double sided board: 8-15um | According to customer requirements | Beyond special abilities |
| Multilayer board: 12-18um | According to customer requirements | Review before receiving orders | ||
| line | Ring edge of hole ring | Double sided plate: 0.125mm | 0.1mm | |
| Outer layer of multilayer board: ≥ 0.125mm | 0.1mm | |||
| Inner layer of multilayer board: ≥ 0.15mm | 0.1mm | |||
| PTH hole rim | Double sided plate: ≥ 0.1mm | |||
| Pad to line distance | Outer layer of multilayer board: ≥ 0.1mm | 0.05mm | ||
| Inner layer of multilayer board: ≥ 0.15mm | 0.1mm | |||
| Npth hole cutting copper | ≥0.2mm | |||
| Grid size | 0.4mm * 0.4mm, 45 ° tilt | |||
| Film compensation | 1 / 3oz bottom copper: 0.02mm | |||
| 1 / 2oz bottom copper: 0.025mm | ||||
| 1oz bottom copper: 0.035mm | ||||
| For the independent line, 0.15mm shall be added on the basis of overall compensation | ||||
| Minimum line width and line spacing | 1 / 2oz bottom copper: 0.05mm | |||
| 1oz bottom copper: 0.10mm | ||||
| Line alignment | ±0.075mm | |||
| Line coincidence | ±0.075mm | |||
| Etching tolerance | ±0.02mm | |||
| Fit | Covering film window opening hole | Drilling: 0.3mm | ||
| Minimum square window covering film | Borehole: 0.7mm | |||
| Minimum window spacing of covering film | Drilling: 0.5mm | 0.3mm | ||
| Glue overflow of covering film | ≤0.15mm | |||
| Coating alignment | ≤0.2mm | ≤0.1mm | ||
| printing | Resistance welding window from pad | 0.10mm | ||
| Unilateral minimum distance | 0.2mm | |||
| Minimum resistance bridge | 0.25mm | |||
| Resistance welding thickness | 10-25um | |||
| Minimum character line width | ≥0.13mm | |||
| Minimum character line height | ≥0.80mm | |||
| Minimum distance from character to pad | 0.30mm | |||
| surface treatment | Thickness of gold and nickel | 0.025um-0.075um/1-3um | ||
| Gold and nickel plating thickness | 0.025um-0.075um/1-3um |
0.1~0.25um |
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